Product proposal
Copper paste Board（ＳＹＣ）
・It is possible to reduce the cost of the substrate than the silver paste.
・ Since compared with the silver paste there is no worry of migration,
It can be used for a wide range of applications.
It will not satisfy the criteria of reliability evaluation, which is determined by the implementation industry.
※CEM-3 t=1.6mm φ0.5mm
| item | Property case （＊There is no standard values） |
note |
|---|---|---|
| High-temperature stress | Before 15mΩ⇒After 28mΩ (＋87%) | 100℃/2000hr |
| Low temperature stress | Before 15mΩ⇒After 15mΩ ( 0%) | -55℃/2000hr | PCT | Before 15mΩ⇒After 18mΩ(＋20%) |
121℃/98%RH/ 196kPa/16hr |
| Hot Oil stress | Before 15mΩ⇒After 15mΩ(0%) | 260℃/10sec/＋20℃/10sec×200cy |
| Thermal shock | Before 15mΩ⇒After 20mΩ(＋33%) | -65℃/30min＋125℃/30min×2000cy |
| Reflow heat test | Before 15mΩ⇒After 16mΩ(＋7%) | 250℃×６cy |
| Bending test | Before 15mΩ⇒After 16mΩ(＋7%) | 5%wrap×100cy |
| Solder heat test | Before 15mΩ⇒After 14mΩ(-7%) | 260℃/5sec×6cy |
| Bias test | P=1.45mm 2000hr＜9×1011Ω・cm | 60℃/90%RH/DC50V/2000hr |
| Tg | 250℃ | TMA |
| Moisture absorptivity | 30% | JEDEC L4 |
| a1 | 29ppm(20℃) | X-ray |
Design criteria of copper paste through-hole
| Design specification (MIN) | |||||
|---|---|---|---|---|---|
| Drill diameter | Pitch | Land diameter | Copper paste diameter |
Over coat diameter |
thickness |
| φ0.45 | 1.5mm | 1.2mm | 0.8mm | 1.8mm | 1.6mm |
| Design specification (MIN) | |
|---|---|
| Drill diameter | φ0.45 |
| Pitch | 1.5mm |
| Land diameter | 1.2mm |
| Copper paste diameter | 0.8mm |
| Over coat diameter | 1.8mm |
| thickness | 1.6mm |
※With regard to the design specification, let me arrangements separately.